Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 1,700 employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.
Our work is very important to us, but so is our life outside of work. Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities. If this specific job opportunity and the chance to work at a nationally renowned R&D innovation company appeals to you, apply now www.draper.com/careers.
Equal Employment Opportunity
Draper is committed to creating a diverse environment and is proud to be an affirmative action and equal opportunity employer. We understand the value of diversity and its impact on a high-performance culture. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, gender identity, national origin, veteran status, or genetic information.
Draper is committed to providing access, equal opportunity and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation, please contact firstname.lastname@example.org.
We are seeking an experienced Material and Process Engineer to collaborate with staff members in the design, development, characterization, and application of a broad range of electronic and MEMS packaging technologies. This includes: surface mount attachment, wafer-level processing and multi-chip module development and failure analysis. The successful candidate will have the ability to apply concepts in mechanical, electrical, and materials engineering to develop new packaging processes and assess the capability of existing process and packaging designs.
B.S. in Materials Science, Physics, Mechanical Engineering, Electrical Engineering, or related discipline
Candidate must be a US citizen or permanent resident and must meet eligibility requirements for access to classified information.